Entering 2024, with the continuous deepening of display trends such as 5G and 8K, the micro-pitch LED market with a point pitch of 1.0mm will further rise, as display trends such as 5G and 8K continue to deepen.
At present, Mini LED packaging has formed including COB (Chip on Board) technology, IMD (Integrated Mounted Devices) integrated packaging technology, and MIP (Micro LED in Package). From a technical perspective, COB is a multi-lamp bead integrated bracket-less packaging technology that directly packages the light-emitting chip on the PCB board, eliminating the cumbersome surface-mounting process and the soldering pins of the bracket.
Each pixel The LED chips and welding wires are tightly encapsulated in the epoxy resin colloid. There are no exposed elements. It is more like a surface light source with excellent integrity and protection.
The LED market will further rise
At present, MiniLED packaging has formed including COB (Chip on Board) technology, IMD (Integrated Mounted Devices) integrated packaging technology, MIP (Micro LED in Package), etc.
From the respective technical point of view, COB is a multi-bead integrated bracket-free packaging technology that directly packages the light-emitting chip on the PCB board, eliminating the cumbersome surface mounting process and eliminating the need for soldering feet of the bracket.
Each pixel the spot LED chips and bonding wires are tightly encapsulated in epoxy resin colloid without any exposed components. It is more like a surface light source with excellent integrity and protection.
MIP is a new packaging architecture based on Micro LED. It is derived from long-experienced small-pitch display products. Its essence is an organic combination of Micro LED and discrete devices. At the same time, the testing process is moved from the chip back to the packaging section, which will effectively reduce the cost increase rate.
In the process of developing into the micro-pitch display era
The industry needs the relay of COB, IMD, MIP and other technical routes, plus with the support of the flip-chip process and the massive transfer method, the dot spacing can be effectively reduced. Because it is difficult for the SMD Screen packaging model to break through the smaller point spacing, and it is also difficult to ensure high reliability and protection.
IMD can be regarded as a small COB unit. The technical difficulties faced are similar to COB packaging, but the difficulty is somewhat reduced. However, the IMD solution has certain physical limitations and cannot infinitely reduce the pixel pitch.
Some problems
Technical problems continue to break through, and the micro-pitch LED display industry is working hard to achieve the technical goals of Micro LED. Whether it is COB technology or IMD technology, the key to each technology route is to quickly reduce costs and achieve industrialization.
With the explosion of the small-pitch market and the market’s demand for high-density high-definition , the packaging forms of COB packaging and IMD packaging with two different technical routes have also begun to compete on the same stage, and the results still need to be tested by the market.
MIP technology adheres to a basic structure that contains complete pixels in terms of packaging scale. MIP is a typical independent lamp bead package and is compatible with downstream surface mount production processes.
This makes MIP more flexible in terms of testing, repair, and process fault tolerance. Traditional surface mount technology and a single specification of MIP can meet the characteristics of multi-standard terminal products and become more flexible.
Under the joint competition between MIP and COB, the “compromise” technical solution IMD may first be marginalized or withdraw from the stage of history… However, outside of consensus, there are still considerable differences in the perceptions of MIP and COB.
The core advantage of MIP packaging lies in its flexibility
Terminal companies, especially terminal brands that have not yet mastered COB technology and have not yet entered the chip-level packaging process market, will be the path to enter the fine-pitch LED market.
More mid-to-low-end brands will use MIP Entering the micro-pitch LED display market may bring about a “copycat effect”.
The impact of uneven terminal quality on the image of MIP technology is still unknown, but is it possible for MIP packaging technology to rely on the flexibility of its production organization? There is still huge suspense in forming real market competitiveness.
The greater significance of MIP is to replace IMD and SMD Screen in terms of small pitch and micro pitch, rather than competing with COB. In the future, there may be a situation where COB and MIP are high and low.
Judging from the current market situation, continuing to do a good job in COB and paralleling is an option in the current market.
For a long time, cooperation between COB and MIP will be greater than competition. Both parties must persist and continue to invest in improvements. It will take time to test what technology will dominate micro-pitch displays in the future.
Mustang LED’s small-pitch LED products have reached a higher level, bringing a better user experience to the end market. It has been widely used in many scenarios such as radio and television, conferences, big data centers, intelligent command centers, monitoring centers, exhibitions, education and teaching, culture and entertainment, telemedicine, and home theaters.
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