Dicing tape, also known as die attach tape or wafer dicing tape, is a specialized adhesive tape used in semiconductor manufacturing and wafer dicing processes. Its primary purpose is to securely mount a semiconductor wafer onto a dicing or sawing frame during the dicing process. Dicing tape plays a crucial role in stabilizing the wafer, protecting its surface, and facilitating the precise cutting of individual chips or dice from the wafer. Here are the key functions and characteristics of dicing tape:
Functions of Dicing Tape:
-
Holding the Wafer: Dicing tape adheres to the backside of a semiconductor wafer, effectively holding it in place on a dicing frame or dicing chuck. This ensures that the wafer remains securely fixed during the dicing process, preventing movement or vibration that could lead to inaccuracies or defects in the cut.
-
Protecting the Wafer Surface: Dicing tape provides a protective layer for the front (active) side of the wafer. It shields the delicate and often sensitive components on the wafer from potential damage or contamination during the dicing process.
-
Reducing Chipping: Dicing tape helps to reduce chipping and cracking along the edges of the cut during the dicing process. It supports the material, minimizing the risk of edge defects on the diced chips.
-
Ease of Handling: The adhesive properties of dicing tape simplify the handling of wafers, making it easier to transport and manipulate the wafers during the dicing and post-dicing processes.
Characteristics of Dicing Tape:
-
Adhesive Properties: Dicing tape has a strong adhesive on one side, which adheres firmly to the backside of the wafer. The adhesive must provide sufficient bonding strength to hold the wafer securely.
-
Release Liner: Dicing tape typically comes with a protective release liner on the adhesive side. This liner is removed when the tape is applied to the wafer, and it prevents the tape from sticking prematurely.
-
Thickness: The thickness of dicing tape can vary, and it is chosen based on the specific requirements of the dicing process and the type of equipment used.
-
Material Compatibility: Dicing tape should be compatible with the material of the wafer, ensuring that it adheres effectively without causing contamination or damage.
-
Temperature Resistance: Dicing tape is designed to withstand the environmental conditions and temperature changes encountered during the dicing process, including exposure to coolants and heat generated by the dicing saw.
-
Tape Expansion Control: Dicing tape manufacturers often design their products to have controlled expansion properties. This helps maintain uniform tension and alignment during the dicing process.
After the dicing process is complete, the diced chips are still adhered to the dicing tape. Typically, a peeling process is employed to remove the chips from the tape, allowing them to be collected, packaged, and further processed.
In summary, dicing tape is a crucial component in semiconductor manufacturing and wafer dicing, as it serves to secure the wafer, protect its surface, and minimize defects during the dicing process, ensuring the production of high-quality semiconductor chips.